Heat conduction film is a heat conduction medium material used to fill the air gap between the heating device and the heat sink or the metal base. Their flexible and elastic characteristics enable them to be used to cover very uneven surfaces. Heat is transferred from the separation device or the entire PCB to the metal housing or diffusion plate, thereby improving the efficiency and service life of the heating electronic components.
thermal film material six key parameters:
(1) thermal conductivity;
(2) material thickness;
(3) material hardness (compression ratio);
(4) thermal impedance;
(5) breakdown voltage (insulation performance);
(6) Sustainable work stable.
Influence factors of thermal film:
In the use of thermal film, pressure and temperature are mutually restricted, with the rise of temperature, after a period of operation of the equipment, thermal film material softening, creep, stress relaxation phenomenon, mechanical strength will decline, sealing pressure will reduce, and vice versa.
(1) has good elasticity and recovery, can adapt to pressure changes and temperature fluctuations;
(2) has proper softness and can fit well with the contact surface;
(3) do not pollute the process medium;
(4) Enough toughness without breaking due to pressure and fastening force;
(5) no hardening at low temperature, small shrinkage;
(6) Good machining performance, easy installation and compaction;
(7) do not adhere to the sealing surface, easy disassembly;
(8) Low price, long service life.